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VOOZH | about |
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VOOZH | about |
Fanless computers and industrial PCs are increasingly deployed as edge nodes for automation systems, real-time video analytics, IoT gateways, and AI inference workloads. These systems must sustain deterministic performance in thermally constrained, vibration-prone, and dust-rich environments where active cooling is either impractical or failure-prone.
SolidRun’s passive-cooling architecture is engineered to manage the thermal load of modern high-density CPUs and GPUs without relying on airflow. Our mechanical and thermal design teams optimize conduction paths from the silicon package through heat spreaders and vapor chambers to custom-machined heatsinks or the device enclosure itself. By reducing the number of thermal junctions and increasing the effective dissipation surface area, the system maintains stable junction temperatures even under continuous high-TDP workloads.
Technical Advantages:
Enhanced Reliability in Harsh Environments
Fan-based systems introduce particulate ingress and mechanical wear. In contrast, fanless enclosures maintain ingress protection ratings, eliminate moving components, and reduce MTBF-related failures. This is especially critical in industrial automation cells, transportation systems, and outdoor edge installations where dust, vibration, and temperature cycling accelerate fan degradation.
Optimized Power and Thermal Efficiency
The compact system architecture and optimized conduction-driven thermal paths enable low overall power budgets and efficient heat spreading. This ensures predictable thermal-throttling behavior and allows operation within defined TDP envelopes without sacrificing sustained performance or overstressing components.
Acoustic and Electromagnetic Benefits
With no active cooling, acoustic emissions are effectively zero—a key requirement for digital signage, hospitality deployments, and HTPC applications. The elimination of high-RPM fans also reduces electromagnetic interference (EMI), improving signal integrity and compliance with stringent industrial EMC standards.
Bedrock RAI300 is powered by the state-of-the-art AMD Ryzen AI 9 HX 370 processor with 12 Zen 5 cores and 24 threads running at up to 5.1 GHz, RDNA 3.5 iGPU, and the XDNA 2 NPU.
Bedrock R8000 is the first industrial PC with AMD Ryzen Embedded 8000, it features Ryzen AI and Hailo AI for over 100 TOPS and with 10 years guaranteed availability.
Bedrock V3000 Basic fanless industrial PC provides exceptional performance in a compact format. Powered by the AMD Ryzen™ Embedded V3000 Processor, the Bedrock V3000 Basic is designed to meet demanding applications under challenging operating conditions.
WE’D LOVE TO HEAR FROM YOU!
WE’D LOVE TO HEAR FROM YOU!
WE’D LOVE TO HEAR FROM YOU!
