This module will give you a glimpse of what you will be learning in the course.

This module introduces students to the world of Micro Electromechanical Systems (MEMS), providing a broad overview of its technology and applications. Students will explore the key materials used in MEMS fabrication and gain practical knowledge of cleanroom protocols essential for the development of MEMS devices. This module lays the foundation for understanding the interplay between materials, mechanical structures, and electronic components that form MEMS systems.

This module focuses on the techniques used in MEMS fabrication, specifically oxidation processes and Physical Vapor Deposition (PVD) methods. Students will explore techniques like electron-beam (E-beam) evaporation and thermal evaporation, while also learning how thermal oxidation is used to develop layers for sensor fabrication. The module will also cover numerical calculations for oxidation processes and deposition techniques.

This module continues exploring MEMS sensor fabrication techniques with an emphasis on PVD sputtering and Chemical Vapor Deposition (CVD). Students will learn about the sputtering process used to deposit thin films and how CVD techniques are used to create high-quality sensor materials. By the end of this module, students will be able to differentiate between PVD and CVD processes and understand their specific applications in MEMS.

In this module, students will dive into the lithographic processes used in MEMS fabrication. Photolithography is a critical technique for patterning microstructures, and students will explore its different stages and techniques. This module also covers numerical calculations related to lithography and discusses how lithography is used in various MEMS applications.

This module covers micromachining techniques, including bulk and surface micromachining, that are integral to MEMS sensor fabrication. Students will learn about the development of MEMS-based VOC sensors, and explore advanced techniques like Deep Reactive Ion Etching (DRIE) and Reactive Ion Etching (RIE). The module also introduces wet etching processes and the concept of Miller indices in crystalline structures.

In this module, students will learn about sensor integration and interfacing techniques essential for MEMS applications. Topics will include 3D printing, PCB design, radar sensors, and sensor communication protocols. Students will also gain practical knowledge of interfacing MEMS sensors with electronic systems, exploring encoding methods and how sensor outputs are processed and transmitted.

This final module focuses on the characterization techniques used to assess MEMS sensor performance and explore their real-world applications. Students will learn about wire bonding techniques and various methods for characterizing MEMS devices. Practical applications of MEMS sensors in industries like healthcare, aerospace, and consumer electronics will also be discussed