This Module will introduce the field of Finite Element Modeling and Simulation (FEA - Finite Element Analysis) as it is practiced in the development and fabrication of MEMS devices and other semiconductor devices. The first section will cover the benefits of using modeling and simulation for product development and manufacturing control. The second section of this module will go into the governing equations capturing the physics of operation of the devices in this sector of Micro Technology. This section also covers – the concept of discretization and approximation theory. Complex partial differential equations of the governing equations are converted to a computer solvable set of linear algebraic equations using approximation theory. Finally, the limitations and shortcomings of FEA is presented, this prepares the students for - factors to consider when using FEA successfully as a powerful and efficient tool.

This module puts the individual micro fabrication process steps (covered in earlier courses) in an integrated process flow or sequence, to fabricate a complete IC (integrated circuit) wafer. A simple example of the early 3 micro m CMOS circuit chip process flow is walked through. The market specification drivers of the IC circuit is touched upon.

Semiconductor industry is a uniquely remarkable industry that has experienced tremendous increase in computation capability, decrease in chip size, decrease in energy consumption and decrease in cost, all at the same time. This transformational industry continues to see Moore’s law evolve in new ways like parallel algorithms in the software, environment interaction device types (MEMS) built from semiconductor materials and fabrication processes, and quantum computing. The Microtechnology ecosystem is strong within USA and includes the leading R&D entities located across the country. There are industry associations and networks that serve this community.